Expert No. 325204 – Engineering Expert – CA(N)
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Expertise Description: Consulting expert in Semiconductor Systems with broad operating experience in senior technical roles at Fairchild, Intel, ESL/TRW, GTE, and three startup companies spanning the semiconductor, printing, and defense industries. Author and owner of over 20 patents. Board member of Silicon Valley Consultant’s Network, CNSV, a special interest group of IEEE. Designed multiple custom integrated circuits, hybrid assemblies, and manufacturing processes. Developed advanced technology for integrating semiconductors into systems, including a new flip chip connector, a novel cooling method, a new test methodology, and a solder-free assembly method. Developing new technology for HDI interconnection substrates supporting a pad pitch as small as 40 um. Has emphasized the fundamental importance of effective rework strategies for locating and replacing defective components in systems. Wafer and panel level processing, including automation for low cost production. Prior expert witness experience.
Areas of Expertise:
Representative Litigation Experience:
- Laser printing technology
- Patent evaluation using Taeus methodology
- Tear-down analysis of liquid crystal displays (LCD)
Representative Consulting Services and/or Projects:
- Wafer level chip scale packaging (WLCSP)
- 3D electronic packaging
- Retractable devices
- Electrostatic devices
Education:
| Degree | Subject | Institution | |
|---|---|---|---|
| M.S. | Electrical Engineering | Northeastern University | |
| E.E. | Electrical Engineering | Northeastern University | |
| B.E. | Electrical Engineering | Auckland University, New Zealand |
Professional Appointment/Association Affiliations: Professional Appointments/Affiliations:
- Life Member, Institute of Electrical and Electronics Engineers
- Board Member, Institute of Electrical and Electronics Engineers Consultants' Network of Silicon Valley
- Member, Silicon Valley Expert Witness Group
- Member, Round Table Group
- Member, National Expert Witness Network
Awards & Honors:
| Best in conference award, International Water-Level Packaging Conference |
