Engineering Expert Witness AZ 531814

Expertise Description

I am an experienced engineering expert witness with over 30 years in the field. My areas of focus include process engineering and analysis, facility layout and design, site selection and strategic planning, yield enhancement, quality assurance, manufacturing operations management, equipment selection and qualification, factory/product cost modeling, nanotechnology, Intellectual property/patent analysis, cleanroom and advanced laboratory design. I have offered consultations and deposition for more than 30 years as an engineering expert witness.

Telecommunications and Energy Expert 384574 NC

Expertise Description

I have more than 25 years experience in the intertwined fields of energy, telecommunications, and electronics. I have extensive experience with mergers and acquisitions activity as well as non-infringement, engineering and global sales. I have held numerous positions in engineering, sales, wireless spectrum, wireless services, manufacturing, product management, strategy, and business management in North America, Asia, and Mexico.

Garment Fashion Industry Expert 365046 CA(N)

Expertise Description

I have over 30 years of experience in the Garment industry. My expertise includes fashion design, factory production, domestic and offshore, operations, international production, textiles technology, importing, costing, product development, retail / sales, visual merchandising, and production strategy. My consultations consisted of sourcing and manufacturing logistics. I also have experience in apparel production and quality assessment. I have prior expert witness experience.

Semiconductor Systems Expert 325204 CA(N)

Expertise Description

I have over 30 years experience in Semiconductor Systems with broad operating experience in senior technical roles, including three startup companies spanning the semiconductor, printing, and defense industries. I have expertise with designing multiple custom integrated circuits, hybrid assemblies, and manufacturing processes. I have experience developing advanced technology for integrating semiconductors into systems, including a new flip chip connector, a novel cooling method, a new test methodology, and a solder-free assembly method. I also have experience developing new technology for HDI interconnection substrates supporting a pad pitch as small as 40 um. I have experience with effective rework strategies for locating and replacing defective components in systems. I also have expertise with wafer and panel level processing, including automation for low cost production. I have prior expert witness experience.