This expert is a semiconductor engineering professional with more than 30 years of experience in semiconductor processing, wafer fabrication, silicon device physics, and integrated circuit (IC) product development. His expertise includes front-end fabrication, back-end testing and assembly, electronic design automation (EDA/CAD) tools, reverse engineering, and intellectual property analysis, with a focus on low-power and high-performance ICs for military and aerospace applications.

He has held senior leadership roles including Chief Technologist, Vice President of Engineering, and Vice President of Technology Development, where he directed semiconductor process development, product design, and manufacturing operations. His experience includes development of radiation-hardened CMOS technologies, non-volatile and embedded memory technologies, multi-chip modules, and microcontroller architectures, as well as the construction and scaling of wafer fabrication facilities and semiconductor manufacturing processes.

The expert has extensive experience in reverse engineering and competitive product analysis, including deconstruction of semiconductor devices to support intellectual property and licensing matters. His work in this area led to multiple successful licensing agreements. He also has significant experience in intellectual property matters, including patent analysis, semiconductor design evaluation, and technical assessment.

He has served as an expert witness in semiconductor-related matters involving processing, device physics, and IC design. His experience includes preparation of expert reports and declarations, deposition testimony, jury trial testimony, and participation in proceedings before the U.S. Patent Office, including inter partes review matters.