Semiconductor Systems Expert Witness CA(N) 325204

Expertise Description

I have over 30 years experience in Semiconductor Systems with broad operating experience in senior technical roles, including three startup companies spanning the semiconductor, printing, and defense industries. I have expertise with designing multiple custom integrated circuits, hybrid assemblies, and manufacturing processes. I have experience developing advanced technology for integrating semiconductors into systems, including a new flip chip connector, a novel cooling method, a new test methodology, and a solder-free assembly method. I also have experience developing new technology for HDI interconnection substrates supporting a pad pitch as small as 40 um. I have experience with effective rework strategies for locating and replacing defective components in systems. I also have expertise with wafer and panel level processing, including automation for low cost production. I have prior expert witness experience.

Areas of Expertise

Expert Witness

My expert witness experience includes Laser printing technology, Patent evaluation using Taeus methodology, Tear-down analysis of liquid crystal displays (LCD).

Consulting Experience

My consulting services include Wafer level chip scale packaging (WLCSP), 3D electronic packaging, Retractable devices, Electrostatic devices.

Relevant Experiences

As a chip designer at major technology company I used a wafer prober many times to check out new chip designs. I also developed a special test setup using Micromanipulator probes, including the cutting of metal traces on the chip, contacting a critical signal with a probe, applying external logic gates to correct a problem, re-inserting the signal onto a metal trace, and verifying system operation with the fix in place.


M.S.Electrical EngineeringNortheastern University
E.E.Electrical EngineeringNortheastern University
B.E.Electrical EngineeringAuckland University New Zealand

Licenses Certifications

Awards & Affiliation

Best in conference award
International Water-Level Packaging Conference

Primary Affiliation

Institute of Electrical and Electronics Engineers

Partial List of Consulting Expert Witness Cases